Substantiation of the adverse replies received by the Council regarding the increased corrosion of stainless steel-silver solder couples exposed to Efferdent's New Improved 36% stronger formulation is not made. Distinctions are, however, observed between the modes of corrosion occurring in the New Improved Efferdent and in the original Efferdent formulation. Corrosion in the New Improved Efferdent occurs via the formation of soluble zinc and copper chlorides that leave the selectively attacked microstructure visible, and in Efferdent nonprotective corrosion product deposition consisting of hydroxides and sulfides occurs that obscures the underlying substrate solder microstructure. The apparent increase in corrosion with New Improved Efferdent may be caused by the incorrect association between macroscopic surface appearance change and the amount of corrosion damage.